McDermid Dia Attach Paste ATROX800HT2VX
Silver sintered die attach paste has excellent thermal conductivity, minimal resin bleed-out, and low levels of condensable organic matter!
The "ATROX 800HT2VX" is a hybrid silver sintering die attach paste designed for GaN and SiC semiconductor power devices, featuring an exceptionally high thermal conductivity. With minimal resin bleed-out and low levels of condensable organic materials, it ensures excellent package reliability with differentiated performance on thin dies. Additionally, this product is formulated for application using the time-pressure pump commonly equipped on most die bonders. 【Typical Properties (Partial)】 <Uncured> ■Type of Chemical: Thermosetting ■Color: Gray ■Storage Temperature: -40℃/°F ■Shelf Life: 6 months *You can download the English version of the catalog. *For more details, please feel free to contact us.
- Company：セイワ 東京本社、関西支社、名古屋営業所、中国無錫 グループ会社 エレクトロン（長野県松本市）
- Price：Other
